The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, has approved four additional semiconductor manufacturing projects under the India Semiconductor Mission (ISM), marking a major step toward strengthening the nation’s chip-making ecosystem.
With these new approvals, India now has 10 sanctioned semiconductor projects across six states, with total planned investments of approximately ₹1.60 lakh crore. The four latest projects—proposed by SiCSem, Continental Device India Pvt. Ltd. (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies—together involve an investment of ₹4,600 crore and will directly employ over 2,000 skilled professionals, while also creating a host of indirect jobs in the electronics manufacturing sector.
Details of the Approved Projects
1. SiCSem – Odisha’s First Commercial Compound Semiconductor Fab
SiCSem Pvt. Ltd., in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish India’s first commercial compound semiconductor fabrication facility in Info Valley, Bhubaneswar, Odisha.
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Product Focus: Silicon Carbide (SiC) devices
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Annual Capacity: 60,000 wafers and 96 million packaged units
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Applications: Missiles, defence systems, electric vehicles (EVs), railways, fast chargers, data centres, consumer electronics, and solar inverters
2. 3D Glass Solutions Inc. – Advanced Packaging Hub in Odisha
3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate facility in Info Valley, Bhubaneswar. This will bring cutting-edge semiconductor packaging technology to India.
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Technologies: Glass interposers with passives, silicon bridges, 3D Heterogeneous Integration (3DHI) modules
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Annual Capacity: 69,600 glass panel substrates, 50 million assembled units, 13,200 3DHI modules
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Applications: Defence, AI, high-performance computing, RF, automotive, photonics, and optical communication
3. ASIP Technologies – Semiconductor Packaging in Andhra Pradesh
Advanced System in Package (ASIP) Technologies, partnering with APACT Co. Ltd., South Korea, will build a semiconductor manufacturing unit in Andhra Pradesh.
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Annual Capacity: 96 million units
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Applications: Mobile phones, set-top boxes, automotive electronics, and other consumer electronics
4. Continental Device India Pvt. Ltd. (CDIL) – Expansion in Punjab
CDIL will expand its discrete semiconductor manufacturing facility in Mohali, Punjab.
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Products: High-power devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors (both silicon and silicon carbide-based)
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Annual Capacity: 158.38 million units
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Applications: EV electronics and charging stations, renewable energy systems, industrial power conversion, and telecom infrastructure
Strategic Impact
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Technology Leadership: These projects will include India’s first compound semiconductor fab and a world-class glass-based substrate packaging unit, both critical for next-gen electronics.
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Economic Boost: Expected to catalyse growth in the domestic electronics manufacturing ecosystem, attracting further investments.
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Atmanirbhar Bharat: Meeting domestic demand for semiconductors across telecom, automotive, data centres, consumer electronics, and industrial sectors.
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Skill Development: Complements existing chip design capabilities supported by Government programs, benefiting over 278 academic institutions, 72 start-ups, and 60,000 trained students.
With global demand for semiconductors rising rapidly, these new projects are set to position India as a key hub in the global chip supply chain while driving self-reliance in advanced technology manufacturing.
